President / January, 2004 — January

Metallurgical engineering consultant and trainer. Engineering consulting for product design, manufacturing process development, cost reduction, quality improvement, failure analysis, and root cause analysis. Product experience includes electronics, aerospace, automotive, medical devices, hardware, industrial equipment, and appliances. Materials experience includes metals, coatings, and adhesives. Familiar with many component fabrication and joining methods. Extensive engineering forensics experience with equipment and metal failures. Developed and present several metallurgy courses geared to design quality and manufacturing engineers. The courses include Principles of Metallurgy, Component Design and Metals Engineering, Steel Metallurgy for Designers, Aluminum Metallurgy for Designers, Preventing Metal Corrosion, Metallurgy and Mechanics of Fatigue, and Failure Analysis of Metal Problems. These courses are offered by Industrial Metallurgists, ASTM, SAE, and AWS.

Materials Engineer/Group Leader / January, 1999 — December, 2004

Led group responsible for materials engineering support of new product development, process development, cost reduction, and quality improvement for the entire 800Myear automotive electronics business. Products included engine controllers, transmission controllers, sensors, and door controllers. Supported four factories worldwide for process development, cost reduction, and quality improvement. Worked with design teams in Illinois and Germany on new product development and cost reduction. Qualified new solder paste for 500Kyear savings. Evaluated and selected materials for RoHS compliance, wrote materials and component specifications, evaluated and developed suppliers of components, and performed root cause analyses.

Research Engineer / January, 1994 — December, 1998

Managed development program for novel electrical interconnection processes and materials. Developed a test method for measuring EMI shielding effectiveness for consumer electronics.

Manufacturing Process Engineer / January, 1990 — December, 1993

Worked in a high-volume integrated circuit factory on the following processes: forming solder bumps on silicon wafers, wafer cleaning and epitaxial silicon deposition, and thin-film metal deposition. Used statistical process control (SPC) to monitor and improve manufacturing processes. Used failure mode effects analysis (FMEA) for process development. Performed root cause analysis to resolve production problems. Developed test methods for evaluating process inputs and output to monitor process variation. Developed and implemented processes for higher throughput. Used equipment automation and process characterization to reduce process variation and process cycle time. Wrote process specifications.